PCB BOARD >> Abilities
1, Layers: 2-24 layers
2, Max manufacturing size: 700 mm*1100 mm
3, Copper foil thickness: 0.5 OZ-13 OZ
4, Board thickness:
2, Max manufacturing size: 700 mm*1100 mm
3, Copper foil thickness: 0.5 OZ-13 OZ
4, Board thickness:
Double sided: |
0.2 mm-6.0 mm |
4 layers: |
0.4 mm-8.0 mm |
6 layers: |
0.8 mm-8.0 mm |
8 layers: |
1.0 mm-8.0 mm |
10layers: |
1.2 mm-8.0 mm |
12layers: |
1.5 mm-8.0 mm |
1, Min Line Width/Space: 3 mil / 3 mil
2, Min finished holes size: 0.15 mm
3, Aspect ratio: 12 : 1
4, Surface treatment: HASL; HASL with Pb free; Immersion Gold; Immersion Tin; Immersion Silver;
5, Gold Finger; Flash Gold; OSP
6, Materials: FR4, Tg130℃/ Tg170℃, Rogers, Berquist, Thermagon, (Taconic)
