Amber mainly produce three kinds of the rigid boards as: Single-Sided PCB, Double-Sided PCB, Multilayer PCB (from 2 to 20 layers)

Detailed Account of Single-Sided PCB

FR1 Single Sided PCB with Peelable Mask, V-Score.

FR4 Single Sided PCB with Red Solder Mask, HASL Finish, Contour Punched.

FR1 Single Sided PCB with Flash Gold, Peelable Mask, White Legend, Hole & Contour Punched.

FR1 Single Sided PCB with Green Soldermask, Yellow Legend, Hole & Contour Punched.

FR4 Single Sided PCB with CNC Drilled Holes, Black Soldermask, White legend, Slot & Contour Punched.

FR1 Single Sided PCB with Carbon Jumper and Carbon Key Pad, White Legend, Hole and Contour Punched.

CEM1 Single Sided PCB with CNC Drilled Holes, Silver Jumper, Slot & Contour Punched.

FR1 Single Sided PCB with Carbon Jumper, Gold Flash Key Pad, Hole & Contour Punched.

Detailed Account of Double-Sided PCB

FR4 Double-Sided PTH PCB with Green Soldermask, White Legend, Gold Edge Connector, V-Scored & Contour Punched.

FR4 Double-Sided PTH PCB with Green Soldermask, Special Cut-Half PTH Hole, Gold Flash Finish.

FR4 Double-Sided PTH PCB with Green Soldermask, White Legend, Gold Flash Finish.

FR4 Double-Sided PTH PCB with Green Soldermask, HASL Finish, Contour Punched.

FR4 Double-Sided PTH PCB with Gold Flash Key Pad, Contour Punched.

FR4 Double-Sided PTH PCB with Green Soldermask, White Legend, V-Scored, & Contour Punched.

FR4 Double-Sided PTH PCB with Blue Solder Mask, White Legend, Gold Flash Finish.

FR4 Double-Sided PTH PCB with White Legend, V-Scored, Contour Punched.

FR4 Double-Sided PTH PCB with Thick Selective Gold plated, Push Back Contour Punching Technology.

FR4 Double-Sided PTH PCB with Black Soldermask, White Legend, HASL Finish, Contour Routed.

FR4 Double-Sided PTH PCB with Green Soldermask, White Legend, V-Scored, Contour Punched.

Detailed Account of Multilayer PCB

Power Module Material：Ceramic+FR4+Copper base Layer Coverage：4 Layers+Copper base Surface Technique：Immersion Gold Specialty：Ceramic+FR4 Multiply materials copper-clad laminate.

O-E Module Material： Ceramic+FR4 Layer Coverage：6 Layers Thickness：1.0 mm Surface Technique：Gold-plate +finger Specialty：Embedded Orientation.

Embedded Systems Material：FR4 Layer Coverage：8 Layers Thickness：1.6 mm Surface Technique：HAL Line Width/Space：4mils/4mils Solder Mask Colour：Yellow.

DC/DC Power Module Material：Hi-Tg (170℃)、FR4 Layer Coverage：10 Layers Thickness：1.6 mm Surface Technique：Immersion Gold Specialty：Copper Weight 105 um Blind-via/Buried-via Larger Current .

Telecommunication base-station Material：FR4 Layer Coverage：8 Layers Thickness：2.0 mm Surface Technique：HAL Line Width/Space：4mils/4mils Specialty：BGA、Impedance Control、Shade Solder.

Data Collect Material：FR4 Layer Coverage：6 Layers Thickness：1.6 mm Surface：Electrolytic Au + Finger Au Weight Of Finger：30 Microinch Solder Mask Colour：blueBlind-via.